Featuring an LCP insulator (UL 94V-0 flame-retardant) and tin-plated phosphor bronze terminals, this connector is designed for high-density PCB board-end connections. Its right-angle surface-mount (90° SMT) structure with buckle locking mechanism ensures stable performance in vibration-prone environments, making it ideal for industrial controls, consumer electronics, and automotive applications.
Features
Compact Design: 4Pin configuration with 1.0mm pitch for space-saving PCB layouts.
High Reliability: Tin-plated (nickel underlayer) phosphor bronze terminals ensure ≤20mΩ contact resistance and ≥5,000 mating cycles.
Mechanical Stability: Buckle locking structure prevents loosening with excellent vibration resistance.
Environmental Durability: Operating temperature range of -25°C to +85°C; UL 94V-0 flame-retardant material.
Automation-Ready: SMT-compatible for high-speed pick-and-place production.
Argument
Material of Main Part/Color | LCP/Beige |
Number of Contacts | 4 Pin |
Rated Current | 1.0A/Pin |
Rated Voltage | 50V AC |
Contact Resistance | 20mΩ MAX. |
Withstand Voltage | 500V AC (1Min) |
Insulation Resistance | 100MΩ MIN |
Operating Temperature | -25℃~ +85℃ |
Core Technology
Key Words:
High-Density 90° SMT Buckle Wafer Connector
Core Advantage:
Buckle locking mechanism prevents accidental disconnection. Tin-plated terminals with nickel underlayer balance conductivity and oxidation resistance.
Technical Features:
1.0mm narrow pitch for miniaturized device layouts.
Application Scenarios
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