This 0.8mm 90° SMT wafer connector features a high-precision LCP insulator (UL 94V-0 flame-retardant) and phosphor bronze gold-plated terminals, designed for high-density PCB board-end connections. Its right-angle surface-mount (90° SMT) structure and compact 0.8mm pitch optimize space-constrained device layouts, making it ideal for consumer electronics, industrial controls, and portable devices.
Features
High-Density Design: Supports 2-20Pin configurations with 0.8mm pitch for narrow-border PCB layouts.
Reliable Contact: Gold-plated phosphor bronze terminals ensure ≤20mΩ contact resistance and ≥5,000 mating cycles.
Environmental Resistance: Operating temperature range of -25℃ to +85℃; UL 94V-0 flame-retardant LCP material.
Automation-Friendly: SMT-compatible for high-speed pick-and-place production.
Argument
| Material of Main Part/Color | LCP/Beige |
| Number of Contacts | 8 Pin |
| Rated Current | 0.5A/Pin |
| Rated Voltage | 30V AC |
| Contact Resistance | 20mΩ MAX. |
| Withstand Voltage | 200V AC (1min) |
| Insulation Resistance | 100MΩ MIN. |
| Operating Temperature | -25℃ ~ +85℃ |
Core Technology
Key Words:
High-Density 90° SMT Wafer Connector (RoHS/UL Certified)
Core Advantage:
8mm height + right-angle mounting saves PCB lateral space.
Technical Features:
Flame-retardant LCP (UL 94V-0) and halogen-free design.
Application Scenarios
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