This dual-layer USB3.0 Type A female socket (DIP 90°) features an LCP insulator and SUS201 stainless steel housing, designed for high-reliability board-level connections compliant with USB 3.0 standards. Its vertical through-hole (90° DIP) mounting optimizes horizontal space utilization, making it ideal for industrial control equipment, security systems, and compact electronic devices. The high-temperature resistance of LCP material and mechanical robustness of SUS201 housing ensure stable performance in harsh environments.
Features
USB 3.0 Compliance: Supports 5V/1.5A power delivery for high-current applications.
5Gbps Data Transfer: USB 3.0 mode with backward compatibility to USB 2.0.
Space-Saving Design: Dual-row vertical pins reduce PCB footprint for high-density layouts.
LCP insulator withstands 260°C reflow soldering with low warpage, ensuring signal integrity.
Gold-Plated Contacts: Oxidation-resistant with ≥1,500 mating cycles.
Automation-Friendly: Compatible with both wave soldering and reflow processes.
Argument
| Material of Main Part/Color | Shell SUS201, LCP/Blue |
| Number of Contacts | 18 Pin |
| Rated Current | PIN&PIN4 1.8A MAX. Other PINS 0.25A MIN. |
| Rated Voltage | 30V AC |
| Contact Resistance | Pin1&Pin4:30mΩ MAX. Other Pins: 50mΩ |
| Withstand Voltage | 100 V AC |
| Insulation Resistance | 100MΩ MIN |
| Insertion Force | 35N MAX. |
| Withdrawal Force | 5N MIN. |
| Service Life | 1,500 Times |
| Operating Temperature | -30℃~ +80℃ |
The demand for high-speed interfaces continues to increase, and dual-layer USB connectors allow device manufacturers to expand I/O capability without enlarging the device footprint. This structure is ideal for hubs, routers, PC motherboards, and embedded systems where multiple USB ports must operate reliably under high data load.
Key differences versus standard USB connectors include:
Two independent USB 3.0 channels in vertically stacked configuration
Higher I/O density without increasing panel area
Enhanced signal integrity for 5Gbps SuperSpeed performance
Reinforced mechanical housing for repetitive plug cycles
Improved grounding and shielding structure
This combination ensures stable performance even in noisy or vibration-prone environments.
Vertically stacked dual connectors significantly increase port density while maintaining strong mechanical stability, ideal for compact equipment designs.
Optimized contact layout and improved shielding maintain superior signal integrity for high-speed data transfer across both ports.
EMI-resistant metal shell ensures stable signal transmission, reduces noise interference, and supports high-speed differential pairs.
Gold-plated terminals maintain low contact resistance and provide reliable mating durability for up to 10000 cycles.
Housing material meets UL94 V-0 rating for safety and long-term operational reliability.
Connector design ensures consistent insertion force, stable contact pressure, and reliable holding force under continuous use.
Dual-layer USB3.0 Type A connectors are widely adopted in multi-device environments, high-speed communication platforms, and I/O-intensive equipment. Typical applications include:
USB 3.0 hubs
Mini PCs and industrial computers
Motherboards and expansion cards
Set-top boxes
Smart gateways and routers
Data acquisition equipment
High-definition multimedia systems
Instrumentation and test equipment
Automotive infotainment systems
Embedded controllers and IoT devices
M&T uses precision tooling, automated assembly, and multi-stage testing to ensure consistent connector performance.
Optimized internal design maintains stable 5Gbps performance even under continuous full-load operation.
M&T supports custom shell shapes, reinforced terminals, modified footprints, grounding structures, and packaging formats to meet various project needs.
Connectors undergo testing such as vibration resistance, heat cycle, plug force, impedance stability, and EMI evaluation.
Suitable for manufacturers with long product life cycles requiring continuous supply without design changes.
Designed for device manufacturers, assembly plants, and system integrators requiring stable pricing and consistent performance.
Dual-layer Type A USB3.0 stacked version
Single-layer USB3.0 Type A
Hybrid USB2.0 + USB3.0 configurations
Reinforced industrial-grade models
Through-hole
Hybrid T/H + SMT
Customized PCB retention features
Consumer electronics-grade
Industrial-grade
High-reliability versions for data hubs and networking equipment
M&T provides drawings, CAD files, and samples upon request.
Procurement teams focusing on USB3.0 connectors typically assess signal integrity, durability, and long-term availability.
M&T addresses these needs with:
Engineering consultation for connector selection
Rapid sample preparation
Technical testing data and compatibility suggestions
Flexible lead time and stable capacity
Customizable configurations for project-specific demands
Whether used in high-speed hubs, embedded computers, industrial communication equipment, or multi-port consumer devices, M&T’s Dual-Layer USB3.0 Type A Female Connectors deliver stable, high-performance connectivity with full engineering support.
Core Technology
Key words:
Dual-Layer USB3.0 Type A Socket (Industrial-Grade High-Density Installation)
Core Advantage:
Combines LCP insulator and SUS201 housing for vibration resistance, thermal stability, and long-term reliability.
Application Scenarios
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