This 32Pin FPC connect features a high-temperature plastic (UL 94V-0 flame-retardant) housing and gold-plated copper alloy terminals. Designed for high-density flexible printed circuit (FPC) connections, its 2.0mm pitch and gold-plated contacts ensure stable signal transmission and high durability. Ideal for applications demanding reliability and compactness, such as consumer electronics, medical equipment, and industrial automation.
Features
High-Density Layout: 32Pin configuration with 2.0mm pitch, supporting multi-layer FPC stacking.
High-Reliability Contact: Gold-plated (or optional tin-plated) copper alloy terminals with ultra-low contact resistance and ≥5,000 insertion cycles.
Environmental Resistance: Operating temperature range of -25℃ to +85℃; UL 94V-0 flame-retardant material ensures safety.
Mechanical Stability: Nickel-tin plated copper alloy PEG (Positioning Engineering Grid) enhances PCB fixation strength.
Automation Compatibility: Compatible with SMT mounting processes for improved production efficiency.
Argument
| Material of Main Part/Color | LCP/Beige |
| Number of Contacts | 32 Pin |
| Pitch | 1.0mm |
| Rated Current | 1.0A AC/DC |
| Rated Voltage | 50V AC/DC |
| Contact Resistance | 20mΩ Max. |
| Operating Temperature | -25℃~ +85℃ |
Core Technology
Key Words:
High-Density FPC Connector
Core Advantage:
Gold-plated terminals reduce impedance to support high-speed data transmission (e.g., LVDS/MIPI), while the terminal + positioning peg design enhances connection stability in vibration-prone environments.
Technical Features:
Flame-retardant and high-temperature-resistant material (UL 94V-0).
Optional gold-plated (high durability) or tin-plated (cost-effective) terminals.
Application Scenarios
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