This FPC connector utilizes high-precision stamped terminals and high-temperature-resistant plastic materials, specifically designed for high-density flexible printed circuit (FPC) connections. Its ultra-thin structure and low insertion/withdrawal force optimize internal layouts for space-constrained devices, making it suitable for applications with stringent requirements for lightweight and reliability, such as consumer electronics, medical equipment, and portable wearable devices.
Features
High-Density Layout: PH0.3mm ultra-narrow pitch supports multi-layer FPC stacking, saving PCB space.
Stable Contact: Gold-plated terminals ensure contact resistance ≤50mΩ and insertion/extraction durability ≥5,000 cycles.
Ultra-Thin Design: Height of 1.0mm, compatible with ultra-thin devices (e.g., foldable smartphones, micro sensors).
Environmental Resistance: Operating temperature range of -55℃ to +85℃, resistant to humidity, heat, and vibration.
Automation Compatibility: SMT mounting process, compatible with high-speed pick-and-place machines.
Argument
| Material of Main Part/Color | LCP/Beige |
| Number of Contacts | 39 Pin |
| Rated Current | 0.5A/Pin |
| Rated Voltage | 50V AC/DC |
| Contact Resistance | Vbus and GND 20mΩ MAX. Other Pins 50mΩ MIN. |
| Insulation Resistance | 100 MΩ MIN |
| Insertion Force | 15N MAX. |
| Withdrawal Force | 3N MIN. |
| Operating Temperature | -55℃~ +85℃ |
Used in display modules, camera connections, fingerprint sensors, and compact internal interconnects.
Ideal for smartwatches, AR/VR equipment, and compact health monitoring devices.
Applies to ultra-thin laptops, foldable devices, and miniaturized gadgets.
Suitable for portable diagnostic equipment where precision and space optimization are critical.
Front Flip Lock Mechanism: Easy cable insertion and locking from the same side
Ultra-Low Profile Design: Supports slim device architecture
Fine-Pitch Terminal Layout: Maximizes signal density
High Alignment Accuracy: Ensures precise mating with FPC
As a specialized 0.3mm pitch FPC connector manufacturer, we offer:
Advanced mold design ensures dimensional accuracy at micro-scale pitch.
Full SMT-compatible production with strict process control for consistency.
Stable gold plating thickness ensures long-term contact reliability.
Optical inspection (AOI)
Coplanarity testing
Contact resistance verification
Insertion/withdrawal cycle testing
We support flexible OEM/ODM requirements:
Custom pin count and layout
Different actuator colors
Enhanced plating thickness options
Customized packaging (Tape & Reel / Tray)
Private labeling and branding
Choose appropriate pin count based on signal complexity and PCB design.
Ensure compatibility with ultra-thin FPC (commonly 0.2mm / 0.3mm).
Front flip lock is ideal for designs requiring front-side access during assembly.
For high-cycle applications, consider reinforced contact designs and higher plating thickness.
RoHS compliant materials
REACH compliant production
UL94V-0 flame-retardant housing
ISO-certified manufacturing system
Deep expertise in ultra-fine pitch connector manufacturing
Proven capability in 0.3mm precision production
Strong R&D support for custom projects
Competitive pricing for large-volume buyers
Fast response for samples and technical inquiries
If you are developing next-generation compact electronics and require a high-precision 0.3mm pitch front flip lock FPC connector, we provide the manufacturing expertise and scalability to support your project from prototype to mass production.
Core Technology
Key words:
PH0.3mm High-Density FPC Connector
Core Advantage:
Differential pair impedance control (90Ω±10%), supports high-speed signal transmission (e.g., LVDS/MIPI). Self-cleaning terminal structure reduces contact failure caused by oxidation.
Technical Features:
Ultra-thin metal shielding layer suppresses EMI interference. Dual-contact redundancy design enhances insertion stability.
Application Scenarios
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Telephone:
+86 769 2305 0865
WeChat:
+86 135 4374 6930 (Jeremy)
+86 134 2479 8678 (Paul)
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