This product utilizes high-precision stamped terminals and high-temperature-resistant plastic materials, specifically designed for high-density flexible printed circuit (FPC) connections. Its ultra-thin structure and low insertion/withdrawal force optimize internal layouts for space-constrained devices, making it suitable for applications with stringent requirements for lightweight and reliability, such as consumer electronics, medical equipment, and portable wearable devices.
Features
High-Density Layout: PH0.3mm ultra-narrow pitch supports multi-layer FPC stacking, saving PCB space.
Stable Contact: Gold-plated terminals ensure contact resistance ≤50mΩ and insertion/extraction durability ≥5,000 cycles.
Ultra-Thin Design: Height of 1.0mm, compatible with ultra-thin devices (e.g., foldable smartphones, micro sensors).
Environmental Resistance: Operating temperature range of -55℃ to +85℃, resistant to humidity, heat, and vibration.
Automation Compatibility: SMT mounting process, compatible with high-speed pick-and-place machines.
Argument
| Material of Main Part/Color | LCP/Beige |
| Number of Contacts | 39 Pin |
| Rated Current | 0.5A/Pin |
| Rated Voltage | 50V AC/DC |
| Contact Resistance | Vbus and GND 20mΩ MAX. Other Pins 50mΩ MIN. |
| Insulation Resistance | 100 MΩ MIN |
| Insertion Force | 15N MAX. |
| Withdrawal Force | 3N MIN. |
| Operating Temperature | -55℃~ +85℃ |
Core Technology
Key words:
PH0.3mm High-Density FPC Connector
Core Advantage:
Differential pair impedance control (90Ω±10%), supports high-speed signal transmission (e.g., LVDS/MIPI). Self-cleaning terminal structure reduces contact failure caused by oxidation.
Technical Features:
Ultra-thin metal shielding layer suppresses EMI interference. Dual-contact redundancy design enhances insertion stability.
Application Scenarios
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